CVE-2025-27043
Published Jul 8, 2025Memory corruption while processing manipulated payload in video firmware.
Vendor/product archive
8 CVEs tagged to qualcomm / sd660 — 0 Critical, 7 High, 1 Medium, 0 Low, 0 Unrated.
Memory corruption while processing manipulated payload in video firmware.
Memory corruption while reading the FW response from the shared queue.
Memory corruption occurs while connecting a STA to an AP and initiating an ADD TS request.
Crafted Binder Request Causes Heap UAF in MediaServer
Buffer copy in GATT multi notification due to improper length check for the data coming over-the-air in Snapdragon Connectivity, Snapdragon Industrial IOT
Improper size validation of QXDM commands can lead to memory corruption in Snapdragon Compute, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile
Improper authorization in DSP process could allow unauthorized users to downgrade the library versions in SD820, SD821, SD820, QCS603, QCS605, SDA855, SA6155P, SA6145P, SA6155, SA…
Out of Bound issue in DSP services while processing received arguments due to improper validation of length received as an argument' in SD820, SD821, SD820, QCS603, QCS605, SDA855…