qualcomm / sm8735 CVEs

Memory corruption occurs when a secure application is launched on a device with insufficient memory.

Memory corruption when copying overlapping buffers during memory operations due to incorrect offset calculations.

Memory corruption while loading an invalid firmware in boot loader.

Transient DOS when a remote device sends an invalid connection request during BT connectable LE scan.

Memory corruption while allocating buffers in DSP service.

Memory corruption during sub-system restart while processing clean-up to free up resources.

Transient DOS may occur while processing malformed length field in SSID IEs.

Memory corruption during dynamic process creation call when client is only passing address and length of shell binary.

Memory corruption while processing INIT and multimode invoke IOCTL calls on FastRPC.

Memory corruption may occur while initiating two IOCTL calls simultaneously to create processes from two different threads.

Information disclosure while creating MQ channels.

Memory corruption may occur during the synchronization of the camera`s frame processing pipeline.

Memory corruption while handling multuple IOCTL calls from userspace for remote invocation.