CVE-2025-47396
Published Jan 7, 2026Memory corruption occurs when a secure application is launched on a device with insufficient memory.
Vendor/product archive
18 CVEs tagged to qualcomm / sm8750 — 0 Critical, 16 High, 2 Medium, 0 Low, 0 Unrated.
Memory corruption occurs when a secure application is launched on a device with insufficient memory.
Memory corruption when copying overlapping buffers during memory operations due to incorrect offset calculations.
Transient DOS when a remote device sends an invalid connection request during BT connectable LE scan.
Memory corruption while allocating buffers in DSP service.
Memory corruption while processing user buffers.
Information disclosure when UE receives the RTP packet from the network, while decoding and reassembling the fragments from RTP packet.
Memory corruption during sub-system restart while processing clean-up to free up resources.
Transient DOS may occur while processing malformed length field in SSID IEs.
Memory corruption during dynamic process creation call when client is only passing address and length of shell binary.
Memory corruption while processing INIT and multimode invoke IOCTL calls on FastRPC.
Memory corruption while decoding of OTA messages from T3448 IE.
Memory corruption may occur while initiating two IOCTL calls simultaneously to create processes from two different threads.
Information disclosure while creating MQ channels.
Transient DOS can occur while processing UCI command.
Memory corruption may occur during the synchronization of the camera`s frame processing pipeline.
Memory corruption while handling multuple IOCTL calls from userspace for remote invocation.
Memory corruption in Camera due to unusually high number of nodes passed to AXI port.
Memory corruption when invalid input is passed to invoke GPU Headroom API call.